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发表于 2009-2-10 19:14:08
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<P class=p0 style="MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt" align=left><SPAN style="FONT-WEIGHT: bold; FONT-SIZE: 16pt; COLOR: rgb(0,0,0); FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><FONT color=darkred size=4>一般COB制作工艺流程及设备应用情况</FONT></SPAN></P>
<P class=p0 style="MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt" align=left><SPAN style="FONT-WEIGHT: bold; FONT-SIZE: 16pt; COLOR: rgb(0,0,0); FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><FONT face=宋体 color=darkred size=4></FONT></SPAN> </P><SPAN style="FONT-WEIGHT: bold; FONT-SIZE: 16pt; COLOR: rgb(0,0,0); FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 0.45pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第一步:扩晶 采用</SPAN><SPAN style="FONT-SIZE: 10.5pt; COLOR: rgb(0,0,0); FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">扩张机</SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">将厂商提供的整张LED晶片薄膜均匀扩张,使附着在薄膜表面紧密排列的LED(发光二极管)晶粒拉开,便于刺晶</SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 0.45pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第二步 背胶 将扩好晶的扩晶环放在已刮好银浆层的背胶机面上,背上银浆.点银浆.适用于散装LED芯片.采用点胶机将适量的银浆点在PCB印刷线路板上.</SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><?xml:namespace prefix = o ns = "urn:schemas-microsoft-com<img src=" /><o:p></o:p></SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 0.45pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第三步 将备好银浆的扩晶环放入刺晶架中,由操作员在显微镜下将LED晶片用刺晶笔刺在PCB印刷线路板上.</SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><o:p></o:p></SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 0.45pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第四步 将刺好晶的PCB印刷线路板放入热循环烘箱中恒温静置一段时间,待银浆固化后取出(不可久置,不然LED芯片镀层会烤黄,即氧化,给邦定造成困难).</SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><o:p></o:p></SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 0.45pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-WEIGHT: bold; FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">注:如有LED芯片邦定,则需要以上几个步骤;如只有IC芯片邦定则取消以上步骤.</SPAN><SPAN style="FONT-WEIGHT: bold; FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><o:p></o:p></SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 0.45pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第五步: 粘芯片,用点胶机在PCB印刷线路板的IC位置上适量的红胶(或黑胶),再用防静电设备(真空吸笔或子)将IC裸片正确放在红胶或黑胶上</SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><o:p></o:p></SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 0.45pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第六步 烘干.将粘好裸片放入热循环烘箱中放在大平面加热板上恒温静置一段时间,也可以自然固化(时间较长)</SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><o:p></o:p></SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 0.45pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第七步: 邦定(打线) 采用铝丝焊线机将晶片(LED晶粒或IC芯片)与PCB板上对应的焊盘铝丝进行桥接,即COB的内引线焊接</SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 0.45pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第八步: 前测. 使用专用检测工具(按不同用途的COB有不同的设备,简单的就是高精密度稳压电源)检测COB板,将不合格的板子重新返修.</SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><o:p></o:p></SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 31.5pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第九步:点胶 采用点胶机将调配好的AB胶适量地点到邦定好的LED晶粒上,IC则用黑胶封装,然后根据客户要求进行外观封装</SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 31.5pt; TEXT-INDENT: -0.42pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"></SPAN></FONT></FONT><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第十步:固化 将封好胶的PCB印刷线路板放入热循环烘箱中恒温静置,根据要求可设定不同的烘干时间</SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><o:p></o:p></SPAN></FONT></FONT></P>
<P class=p0 style="LAYOUT-GRID: 15.6pt none; MARGIN-TOP: 0pt; MARGIN-BOTTOM: 0pt; MARGIN-LEFT: 26.25pt; TEXT-INDENT: -0.21pt; TEXT-ALIGN: justify" align=left><FONT color=darkred><FONT size=4><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'">第十一步:后测 将封装好的PCB印刷线路板再用专用的检测工具进行电气性能测试,区分好坏优劣</SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><o:p></o:p></SPAN></FONT></FONT></P><!--EndFragment--></SPAN><SPAN style="FONT-SIZE: 10.5pt; FONT-FAMILY: '宋体'; mso-spacerun: 'yes'"><!--EndFragment--></SPAN><!--EndFragment--></SPAN><!--EndFragment--> |
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